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CVE-2019-14051

Estado: ModificadaAlta (7.8)—

Subsequent additions performed during Module loading while allocating the memory would lead to integer overflow and then to buffer overflow in Snapdragon Industrial IOT in MDM9206, MDM9607

CVSS

Probabilidad de explotación (EPSS)

EPSS (Exploit Prediction Scoring System, de FIRST) estima la probabilidad de que una vulnerabilidad sea explotada en 30 días. Complementa a CVSS (impacto) y a CISA KEV (explotación confirmada).

Tecnologías afectadas (2)

Qualcomm — Mdm9206 FirmwareQualcomm — Mdm9607 Firmware

CWE

Referencias

JSON original (NVD)

Mostrar
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  "id": "CVE-2019-14051",
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          "vectorString": "AV:L/AC:L/Au:N/C:C/I:C/A:C",
          "authentication": "NONE",
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  "affected": [
    {
      "source": "product-security@qualcomm.com",
      "affectedData": [
        {
          "vendor": "Qualcomm, Inc.",
          "product": "Snapdragon Industrial IOT",
          "versions": [
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  "published": "2020-02-07T05:15:11.903",
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      "url": "https://www.qualcomm.com/company/product-security/bulletins/february-2020-bulletin",
      "tags": [
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      "value": "Subsequent additions performed during Module loading while allocating the memory would lead to integer overflow and then to buffer overflow in Snapdragon Industrial IOT in MDM9206, MDM9607"
    },
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      "value": "Las adiciones posteriores llevadas a  cabo durante la carga del Módulo mientras se asigna la memoria conllevaría a un desbordamiento de enteros y luego al desbordamiento del búfer en los productos Snapdragon Industrial IOT en las versiones  MDM9206, MDM9607."
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  "lastModified": "2026-06-17T02:17:43.640",
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