« Volver al listado

Qualcomm

Qualcomm Snapdragon 835 Firmware: vulnerabilidades y CVE

Qualcomm Snapdragon 835 Firmware tiene 13 vulnerabilidades publicadas, 0 de ellas en los últimos 12 meses. 0 son críticas y 0 figuran en el catálogo de explotación activa de CISA.

CVE13
Últimos 12 meses0
Críticas0
Explotadas activamente0

Todas las vulnerabilidades en el catálogo →⭐ Seguir esta tecnología

Últimas vulnerabilidades

CVESeveridadEPSSExplotación activaPublicadaDescripción
CVE-2023-33021Alta (7.8)0.12%—5 sept 2023
Memory corruption in Graphics while processing user packets for command submission.
CVE-2023-28584Alta (7.5)0.35%—5 sept 2023
Transient DOS in WLAN Host when a mobile station receives invalid channel in CSA IE while doing channel switch announcement (CSA).
CVE-2023-28567Alta (7.8)0.12%—5 sept 2023
Memory corruption in WLAN HAL while handling command through WMI interfaces.
CVE-2023-28565Alta (7.8)0.12%—5 sept 2023
Memory corruption in WLAN HAL while handling command streams through WMI interfaces.
CVE-2023-28564Alta (7.8)0.12%—5 sept 2023
Memory corruption in WLAN HAL while passing command parameters through WMI interfaces.
CVE-2023-28542Alta (7.8)0.12%—4 jul 2023
Memory Corruption in WLAN HOST while fetching TX status information.
CVE-2023-28541Alta (7.8)0.12%—4 jul 2023
Memory Corruption in Data Modem while processing DMA buffer release event about CFR data.
CVE-2023-24854Alta (7.8)0.12%—4 jul 2023
Memory Corruption in WLAN HOST while parsing QMI WLAN Firmware response message.
CVE-2023-24851Alta (7.8)0.12%—4 jul 2023
Memory Corruption in WLAN HOST while parsing QMI response message from firmware.
CVE-2023-22667Alta (7.8)0.12%—4 jul 2023
Memory Corruption in Audio while allocating the ion buffer during the music playback.
CVE-2023-21637Alta (7.8)0.11%—4 jul 2023
Memory corruption in Linux while calling system configuration APIs.
CVE-2023-21629Media (6.8)0.19%—4 jul 2023
Memory Corruption in Modem due to double free while parsing the PKCS15 sim files.
CVE-2023-21624Media (5.5)0.11%—4 jul 2023
Information disclosure in DSP Services while loading dynamic module.

Otros productos de Qualcomm