Vulnerabilidades

Memory corruption in DSP Services during a remote call from HLOS to DSP.

Cryptographic issue in GPS HLOS Driver while downloading Qualcomm GNSS assistance data.

Transient DOS in Data modem while handling TLB control messages from the Network.

Transient DOS in Modem after RRC Setup message is received.

Memory corruption while sending SMS from AP firmware.

Memory corruption in HLOS while invoking IOCTL calls from user-space.

Memory corruption while using the UIM diag command to get the operators name.

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

Transient DOS in Bluetooth Host while rfc slot allocation.

Memory corruption in BT controller while parsing debug commands with specific sub-opcodes at HCI interface level.

Information disclosure when the trusted application metadata symbol addresses are accessed while loading an ELF in TEE.

Memory corruption while loading an ELF segment in TEE Kernel.

Memory corruption in UTILS when modem processes memory specific Diag commands having arbitrary address values as input arguments.

Memory corruption in MPP performance while accessing DSM watermark using external memory address.

Memory Corruption in SPS Application while exporting public key in sorter TA.

Memory Corruption in Audio while invoking IOCTLs calls from the user-space.

Memory Corruption in camera while installing a fd for a particular DMA buffer.

Memory Corruption in Radio Interface Layer while sending an SMS or writing an SMS to SIM.

Memory corruption in Audio while processing the VOC packet data from ADSP.

Memory Corruption in Audio while invoking callback function in driver from ADSP.

Transient DOS in WLAN Firmware while parsing no-inherit IES.

Memory corruption in Automotive Audio while copying data from ADSP shared buffer to the VOC packet data buffer.

Memory corruption while processing audio effects.

Cryptographic issue in HLOS during key management.

Information Disclosure in Qualcomm IPC while reading values from shared memory in VM.